青云英语翻译

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翻译结果1翻译结果2 翻译结果3翻译结果4翻译结果5

翻译结果1复制译文编辑译文朗读译文返回顶部

No barrier and copper seed layer plating using atomic layer deposition deposited copper interconnect technology.

翻译结果2复制译文编辑译文朗读译文返回顶部

use of the atomic layer deposition technologies sediment barrier and copper plating without seed layer is the copper interconnect technology research hot spot. ;

翻译结果3复制译文编辑译文朗读译文返回顶部

Using atomic layer deposition no seed layer deposition of barrier and copper plating is currently the research hotspots of copper interconnect technology.

翻译结果4复制译文编辑译文朗读译文返回顶部

Use of the atomic layer deposition technologies sediment barrier and copper plating without seed layer is the copper interconnect technology research hot spot.

翻译结果5复制译文编辑译文朗读译文返回顶部

The use atomic shell deposits the technical deposition barrier and the copper non-seed level galvanization is the present copper interconnection technique research hot spot.
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