青云英语翻译
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a我們和其他供應商購買是4元,你的太貴了,價格能否降低? We and other supplier purchase is 4 Yuan, you too have been expensive, whether does the price reduce? [translate]
ait was raining hard yesterday 它昨天是下雨坚硬 [translate]
aI will make love to be opened to warm your hands, right and left. 我将做将被打开的爱温暖您的手，权利和左。 [translate]
a说相声 说相声 [translate]
aBlaVer BlaVer [translate]
atwo other Chegets exist，held by the defense ministesr and the chief of the general staff two other Chegets exist，held by the defense ministesr and the chief of the general staff [translate]
aou can you up NO can no BB ou能您没有罐头没有B到B [translate]
aa ciggarrete smoked by me 我抽烟的ciggarrete [translate]
aAttached is the payment request for the plywood crates. 正在翻译，请等待... [translate]
awell fitting ones freely 好的配件自由一个 [translate]
aNothing in this letter agreement is intended to or shall create any obligation of Dresser to the Operator and the Co-Ventures with respect to the Order(s). With respect to the Order(s), Dresser shall be obligated only to Jiyou under and subject to the terms of the agreement between Dresser and Jiyou and Jiyou shall be 什么都在这个信件协议没有意欲对也不会创造梳妆台的任何义务到操作员和Co事业关于顺序(s)。 关于顺序(s)，梳妆台将仅被强制对Jiyou下面，并且受协议的期限支配在梳妆台之间和Jiyou和Jiyou将被强制对操作员根据和受协议支配在Jiyou和操作员之间。 [translate]
acredit to Interest Revenue 感兴趣收支的信用 [translate]
a2007shiraz 2007shiraz [translate]
aA boy said the water in the river behind his house was always 男孩说水在河在他的房子之后总是 [translate]
ano porosity, damages or sandblasting allowed. 多孔性、损伤或者喷砂清理没有准许。 [translate]
areqirements reqirements [translate]
asingle custom 唯一风俗 [translate]
aA METHOD OF PRODUCING A HETEROSTRUCTURE WITH LOCAL ADAPTATION OF THE THERMAL EXPANSION COEFFICIENT 导致一种异质结构方法以热扩散系数的地方适应 [translate]
aObstaculizar su apertura o Obstaculizar su apertura [translate]
aWafer layer cleaving method for semiconductor substrates, involves providing donor wafer placed in horizontal position during thermal anneal to detach wafer layer with cleaved surface 劈开方法为半导体基体的薄酥饼层数，介入提供在横拍安置的施主薄酥饼在上升暖流期间锻炼分开薄酥饼层数与被劈开的表面 [translate]
aMethod for bonding a wafer onto another wafer to realize a multi-layer semiconductor structure. 方法为结合一个薄酥饼另一个薄酥饼体会一个多层半导体结构。 [translate]
athere is a problem with the password you entered passwords must be aminimum ofe characters long can contain ketters and numbers and must containat least one of each passwordsare case-sensitive your username cannot sooear in your password 有一个问题以您输入密码必须是aminimum ofe字符能长期包含ketters和数字并且必须containat最少一个每passwordsare区分大小写您的用户名不能sooear在您的密码的密码 [translate]
aUsed for preparing a structure e.g. semiconductor on insulator (SeOI) structure, strained silicon on SiGe on insulator structure, strained silicon on insulator (sSOI) structure, that is utilized during an electronic component e.g. CMOS component, manufacturing step (claimed). 为准备结构使用即。 半导体在绝缘体 (SeOI) 结构，被劳损的硅在SiGe在绝缘体结构，被劳损的硅在绝缘体 (sSOI) 结构，被运用在电子元件期间即。 CMOS组分，被要求的制造的 (步)。 [translate]
aComposite material part i.e. substrate, treating method for e.g. electronic industry, involves returning weakened layer to ambient temperature and detaching layer from rest of composite material part at weakened layer 合成材料零件即。 基体，对待方法为即。 电子工业，介入退回被减弱的层数到周围温度和分开层数从其余合成材料零件在被减弱的层数 [translate]
aProcess for realizing connection structure in semiconductor substrates of semiconductor system, involves selecting length of diffusion barrier structure based on value of misalignment of connection structure during integration of substrates 过程为体会连接结构在半导体系统半导体基体，介入选择根据连接结构的不同心度的价值的扩散势垒区结构的长度在基体的综合化期间 [translate]
aElements assembling method for forming heterostructure, involves assembling substrates by contacting exposed surfaces of gluing layers, and annealing substrates at gluing interface stiffening temperature lower than specific degree Celsius 装配方法为形成的元素异质结构，介入装配基体通过与胶合联系层数被暴露的表面和锻炼基体在胶合接口僵住的温度低比具体摄氏度 [translate]
aRouting Number 发送数字 [translate]
ayes she just travel one week. yes she just travel one week. [translate]
aMethod for fabricating silicon-on-insulator (SOI) substrate for optoelectronic sensor, involves epitaxially forming semiconductor layer having different dopant concentration on modified highly doped semiconductor layer 方法为制造硅在绝缘体 (SOI) 基体为光电子传感器，在修改过的高度被掺杂的半导体层数介入外延地形成半导体层数有另外掺质浓度 [translate]
a我們和其他供應商購買是4元,你的太貴了,價格能否降低? We and other supplier purchase is 4 Yuan, you too have been expensive, whether does the price reduce? [translate]
ait was raining hard yesterday 它昨天是下雨坚硬 [translate]
aI will make love to be opened to warm your hands, right and left. 我将做将被打开的爱温暖您的手，权利和左。 [translate]
a说相声 说相声 [translate]
aBlaVer BlaVer [translate]
atwo other Chegets exist，held by the defense ministesr and the chief of the general staff two other Chegets exist，held by the defense ministesr and the chief of the general staff [translate]
aou can you up NO can no BB ou能您没有罐头没有B到B [translate]
aa ciggarrete smoked by me 我抽烟的ciggarrete [translate]
aAttached is the payment request for the plywood crates. 正在翻译，请等待... [translate]
awell fitting ones freely 好的配件自由一个 [translate]
aNothing in this letter agreement is intended to or shall create any obligation of Dresser to the Operator and the Co-Ventures with respect to the Order(s). With respect to the Order(s), Dresser shall be obligated only to Jiyou under and subject to the terms of the agreement between Dresser and Jiyou and Jiyou shall be 什么都在这个信件协议没有意欲对也不会创造梳妆台的任何义务到操作员和Co事业关于顺序(s)。 关于顺序(s)，梳妆台将仅被强制对Jiyou下面，并且受协议的期限支配在梳妆台之间和Jiyou和Jiyou将被强制对操作员根据和受协议支配在Jiyou和操作员之间。 [translate]
acredit to Interest Revenue 感兴趣收支的信用 [translate]
a2007shiraz 2007shiraz [translate]
aA boy said the water in the river behind his house was always 男孩说水在河在他的房子之后总是 [translate]
ano porosity, damages or sandblasting allowed. 多孔性、损伤或者喷砂清理没有准许。 [translate]
areqirements reqirements [translate]
asingle custom 唯一风俗 [translate]
aA METHOD OF PRODUCING A HETEROSTRUCTURE WITH LOCAL ADAPTATION OF THE THERMAL EXPANSION COEFFICIENT 导致一种异质结构方法以热扩散系数的地方适应 [translate]
aObstaculizar su apertura o Obstaculizar su apertura [translate]
aWafer layer cleaving method for semiconductor substrates, involves providing donor wafer placed in horizontal position during thermal anneal to detach wafer layer with cleaved surface 劈开方法为半导体基体的薄酥饼层数，介入提供在横拍安置的施主薄酥饼在上升暖流期间锻炼分开薄酥饼层数与被劈开的表面 [translate]
aMethod for bonding a wafer onto another wafer to realize a multi-layer semiconductor structure. 方法为结合一个薄酥饼另一个薄酥饼体会一个多层半导体结构。 [translate]
athere is a problem with the password you entered passwords must be aminimum ofe characters long can contain ketters and numbers and must containat least one of each passwordsare case-sensitive your username cannot sooear in your password 有一个问题以您输入密码必须是aminimum ofe字符能长期包含ketters和数字并且必须containat最少一个每passwordsare区分大小写您的用户名不能sooear在您的密码的密码 [translate]
aUsed for preparing a structure e.g. semiconductor on insulator (SeOI) structure, strained silicon on SiGe on insulator structure, strained silicon on insulator (sSOI) structure, that is utilized during an electronic component e.g. CMOS component, manufacturing step (claimed). 为准备结构使用即。 半导体在绝缘体 (SeOI) 结构，被劳损的硅在SiGe在绝缘体结构，被劳损的硅在绝缘体 (sSOI) 结构，被运用在电子元件期间即。 CMOS组分，被要求的制造的 (步)。 [translate]
aComposite material part i.e. substrate, treating method for e.g. electronic industry, involves returning weakened layer to ambient temperature and detaching layer from rest of composite material part at weakened layer 合成材料零件即。 基体，对待方法为即。 电子工业，介入退回被减弱的层数到周围温度和分开层数从其余合成材料零件在被减弱的层数 [translate]
aProcess for realizing connection structure in semiconductor substrates of semiconductor system, involves selecting length of diffusion barrier structure based on value of misalignment of connection structure during integration of substrates 过程为体会连接结构在半导体系统半导体基体，介入选择根据连接结构的不同心度的价值的扩散势垒区结构的长度在基体的综合化期间 [translate]
aElements assembling method for forming heterostructure, involves assembling substrates by contacting exposed surfaces of gluing layers, and annealing substrates at gluing interface stiffening temperature lower than specific degree Celsius 装配方法为形成的元素异质结构，介入装配基体通过与胶合联系层数被暴露的表面和锻炼基体在胶合接口僵住的温度低比具体摄氏度 [translate]
aRouting Number 发送数字 [translate]
ayes she just travel one week. yes she just travel one week. [translate]
aMethod for fabricating silicon-on-insulator (SOI) substrate for optoelectronic sensor, involves epitaxially forming semiconductor layer having different dopant concentration on modified highly doped semiconductor layer 方法为制造硅在绝缘体 (SOI) 基体为光电子传感器，在修改过的高度被掺杂的半导体层数介入外延地形成半导体层数有另外掺质浓度 [translate]
