青云英语翻译

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翻译结果1翻译结果2 翻译结果3翻译结果4翻译结果5

翻译结果1复制译文编辑译文朗读译文返回顶部

过程,用于在半导体系统的半导体衬底实现的连接结构,涉及集成基板的期间选择扩散阻挡层结构的长度的基础上的连接结构的偏差值

翻译结果2复制译文编辑译文朗读译文返回顶部

为实现过程连接结构的半导体基片的半导体系统,包括选择长度的弥散障碍结构基础上的偏差值的连接结构的承印物在一体化

翻译结果3复制译文编辑译文朗读译文返回顶部

为实现连接结构的半导体基板半导体系统的过程,涉及到选择在基片集成期间基于值的连接结构失调的扩散屏障结构的长度

翻译结果4复制译文编辑译文朗读译文返回顶部

体会的连接结构过程在半导体系统半导体基体,介入选择根据连接结构的不同心度的价值的扩散势垒区结构的长度在基体的综合化时

翻译结果5复制译文编辑译文朗读译文返回顶部

过程为体会连接结构在半导体系统半导体基体,介入选择根据连接结构的不同心度的价值的扩散势垒区结构的长度在基体的综合化期间
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aProcess for realizing connection structure in semiconductor substrates of semiconductor system, involves selecting length of diffusion barrier structure based on value of misalignment of connection structure during integration of substrates 过程为体会连接结构在半导体系统半导体基体,介入选择根据连接结构的不同心度的价值的扩散势垒区结构的长度在基体的综合化期间 [translate]