青云英语翻译

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翻译结果1翻译结果2 翻译结果3翻译结果4翻译结果5

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的制造方法,半导体基板的制造如集成电路器件,包括从供体结构在弱化区分开传输层,以形成复合衬底,其包括传输层和金属层

翻译结果2复制译文编辑译文朗读译文返回顶部

其制造方法半导体基板的制造业例如集成电路设备,包括分离传输层结构从捐助国在削弱了区域,形成复合基材包括转让和金属层

翻译结果3复制译文编辑译文朗读译文返回顶部

制造半导体基板例如制造集成电路设备的方法,涉及从捐助者结构减弱区,形成由转让和金属层组成的复合衬底分开传输层

翻译结果4复制译文编辑译文朗读译文返回顶部

制造的半导体基体即方法制造的集成电路设备,介入分离调动层数从施主结构在被减弱的区域形成包括调动和金属层数的综合基体

翻译结果5复制译文编辑译文朗读译文返回顶部

方法为制造半导体基体为制造业即。 集成电路设备,介入分离调动层数从施主结构在被减弱的区域形成包括调动和金属层数的综合基体
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aachieving longterm 达到长期 [translate] 
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awater hover 水翱翔 [translate] 
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amultivitamin supplement multivitamin补充 [translate] 
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aenbeffect enbeffect [translate] 
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aInternal group 内部小组 [translate] 
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aThe process consuming reduced time can reduce the damage caused to semiconductor device and integrated circuits devices formed on semiconductor wafer. 消耗减少的时间的过程可能减少损伤被造成对在半导体片和集成电路设备形成的半导体装置。 [translate] 
aMethods of fabricating semiconductor structures and devices with strained semiconductor material 制造半导体结构和设备方法与被劳损的半导体材料 [translate] 
aMethod of fabricating semiconductor structure or device such as LED, laser, optical sensor, power electronic device and solar cell (all claimed). Uses include but are not limited to integrated circuits (ICs), resonant cavity LEDs (RCLEDs), vertical cavity surface emitting lasers (VCSELs), bipolar junction transistors ( 制造半导体结构或设备方法例如LED, laser,光学传感器,供给所有被要求的电子设备和 (太阳能电池动力)。 用途包括,但没有被限制到集成电路 (ICs),谐振腔LEDs (RCLEDs),垂直的洞表面散发的lasers (VCSELs),双极结晶体管 (BJTs),力量MOSFETs、可控硅整流器、肖特基二极管、连接点场效应晶体管 (JFETs),绝缘栅的双极晶体管 (IGBTs) 和正面内在消极 (PIN) 二极管。 [translate] 
aSemiconductor wafer transfer device for use in semiconductor processing equipment, has passageway formed from inlet port to outlet port, through which active gas limiting decomposition or sublimation of surface of wafer, flows 半导体片调动设备用于半导体处理设备,有从进气孔口形成的通道到出油口,限制表面薄酥饼,流程的分解或升华的活跃气体 [translate] 
aThe thermal damage of semiconductor wafer can be prevented effectively. The temperature ramping of growth chambers can be reduced and eliminated and hence wafer throughput can be improved effectively. 半导体片热量损伤可以有效地被防止。 可以减少温度ramping成长房间,并且消灭并且可以有效地改进薄酥饼生产量。 [translate] 
aMetallic carrier for layer transfer and methods for forming the same 金属载体为层数调动和方法为形成同样 [translate] 
aMethod for fabricating semiconductor substrate for manufacturing e.g. integrated circuit device, involves separating transfer layer from donor structure at weakened zone to form composite substrate comprising transfer and metallic layers 方法为制造半导体基体为制造业即。 集成电路设备,介入分离调动层数从施主结构在被减弱的区域形成包括调动和金属层数的综合基体 [translate]