青云英语翻译

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翻译结果1翻译结果2 翻译结果3翻译结果4翻译结果5

翻译结果1复制译文编辑译文朗读译文返回顶部

制造半导体结构或装置,例如方法主导,涉及沉积半导体材料的另一层超过一层,支持一个层上粘结层时,在粘性状态提供粘结层

翻译结果2复制译文编辑译文朗读译文返回顶部

其制造方法的半导体结构或装置(如LED、涉及到另一个图层,存入半导体材料在一个图层,当支持一个图层上绑定图层,图层提供绑定在粘性状态

翻译结果3复制译文编辑译文朗读译文返回顶部

例如制作半导体结构或设备的方法 LED,涉及存入另一层的半导体材料超过一个图层,在粘结层上支持一个图层时,提供粘结层粘性状态

翻译结果4复制译文编辑译文朗读译文返回顶部

当支持在接合层数的一层数和提供结合的层数制造半导体结构或设备即方法LED,在黏状态时,介入放置半导体材料另一层数一层数

翻译结果5复制译文编辑译文朗读译文返回顶部

制造半导体结构或设备方法即。 当支持一层数和提供接合层数LED,在黏状态时,在接合层数介入放置半导体材料另一层数一层数
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aMethod of fabricating semiconductor structure or device e.g. LED, involves depositing another layer of semiconductor material over one layer, when supporting one layer on bonding layer, and providing bonding layer in viscous state 制造半导体结构或设备方法即。 当支持一层数和提供接合层数LED,在黏状态时,在接合层数介入放置半导体材料另一层数一层数 [translate]